Multichip Websites
IMAPS - International Microelectronics Assembly and Packaging Society
IMAPS is bringing together the entire microelectronics supply chain. The largest society dedicated to the advancement and growth of microelectronics, electronics packaging and assembly technologies through professional education. IMAPS leads the Microelectronics Packaging, Interconnect and Assembly Community, providing
1,355,936
$
960.00
IMAPS 2017, Raleigh - 50th International Symposium on Microelectronics
IMAPS 2017 is bringing together the entire microelectronics supply chain. The largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. IMAPS will lead the Microelectronics Packaging, Interconnect and Assembly Community, providing
Not Applicable
$
8.95
WAFER FAB COMPONENTS,BARE DICE PRODUCTS,CHIP DIODESS MANUFACTURER,BARE
Bare die products,bare dice components, bare dies is a manufacturer of semiconductor chip and wire components and thin film products for chip and wire hybrid circuits assembly. manufactures known good dies, bare die,flip chip and wafer-level chip-scale packaging for system-in-package (SiP),multi-chip modules packaging.
Not Applicable
$
8.95
WAFER FAB COMPONENTS,BARE DICE TECHNOLOGIES,CHIP DIODESS MANUFACTURER,
Bare die TECHNOLOGIES,bare dice components, bare dies is a manufacturer of semiconductor chip and wire components and thin film TECHNOLOGIES for chip and wire hybrid circuits assembly. manufactures known good dies, bare die,flip chip and wafer-level chip-scale packaging for system-in-package (SiP),multi-chip modules pa
Not Applicable
$
8.95
WAFER FAB COMPONENTS,BARE DICE TECHNOLOGIES,CHIP DIODESS MANUFACTURER,
Bare die TECHNOLOGIES,bare dice components, bare dies is a manufacturer of semiconductor chip and wire components and thin film TECHNOLOGIES for chip and wire hybrid circuits assembly. manufactures known good dies, bare die,flip chip and wafer-level chip-scale packaging for system-in-package (SiP),multi-chip modules pa
Not Applicable
$
8.95
WAFER FAB COMPONENTS,BARE DICE TECHNOLOGIES,CHIP DIODESS MANUFACTURER,
Bare die TECHNOLOGIES,bare dice components, bare dies is a manufacturer of semiconductor chip and wire components and thin film TECHNOLOGIES for chip and wire hybrid circuits assembly. manufactures known good dies, bare die,flip chip and wafer-level chip-scale packaging for system-in-package (SiP),multi-chip modules pa
Not Applicable
$
8.95
