Die Attach Websites
Electronic Materials Private Limited - Home
Distributor of Adhesives, Encapsulants, Coatings, Underfills, Engineered Films, Thermal Management, Dicing Coolant & Lubricant, EMI Shielding, Microwave Absorber, RFID Ink, Active Solder Alloy, Alkali Earth Metal, Custom Packaging, Adhesive Film & Preform
Welcome to Sensonix
An electronic design and manufacturing services provider Offering ASIC design and manufacutre, PCB, MCM and Chip on Board design and assembly
AAM - Alpha Advanced Materials - Atrox, Die Attach, Die Attach Paste,
ALPHA ADVANCED MATERIALS is committed to providing the global semiconductor packaging manufacturers with innovative, high performance materials. Our products enable our valued customers to meet the evolving and demanding needs of the industry. ATROX® die attach paste and ATROX® die attach film products offer excellent
IMAPS - 17th Symposium on Polymers for Microelectronics
IMAPS is organizing the 17th Symposium on Polymers for microelectronics with a theme of: Innovations Driving a Smart and Interconnected World, The Symposium will continue the event’s focus on polymeric materials for microelectronic applications including traditional and new application areas. Traditional areas covered
Welcome to Sensonix
An electronic design and manufacturing services provider Offering ASIC design and manufacuter, PCB, MCM and Chip on Board design and assembly
HYBOND, Inc.
HYBOND, Inc. designs, manufactures, and sells; Thermosonic Ball and Wedge Wire Bonders, Peg Bonders (Single Point TAB Bonders), Epoxy and Silver-Glass Die Bonders, Eutectic and Laser Diode Die Bonders, Pulsed Heat Fluxless/Eutectic Die Attach Station, DFS Universal Bonder Test Units, and a variety of adjustable height
Hybrid Circuit - Dynamic Hybrids Inc., Thick Film Circuit Boards, Thic
Dynamic Hybrids Inc., Thick Film Circuit Boards, Thick Film Manufacturing Hybrid Thick Film Circuits, Hybrid Circuit Manufacturer, Substrates, Wire Bonding, Military Hybrid Circuit, die attach, prototypes, Hermetic Packages, hybrid circuit, Direct Bond Copper, thick-film, fr4 to ceramic, substrates, resistor networks,