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Bourns, Inc., a global manufacturer of automotive electronic components, circuit protection, magnetic and resistive products and sensors and controls.
178,468
$
67,200.00
Solutions for the RF, Microwave and Telecommunications Industries - Am
ATC provides component and custom integrated packaging solutions for RF, Microwave and Telecommunications including single layer and multilayer capacitors, assemblies, voltage dividers, resistors, power terminations, resistive products, attenuators, multilayer chip and wire wound inductors.
816,478
$
1,440.00
AVX Online
Product offerings that include ceramic and tantalum capacitors, connectors, thick and thin film capacitors, resistors and integrated passive components
Not Applicable
$
8.95
Solutions for the RF, Microwave and Telecommunications Industries - Am
ATC provides component and custom integrated packaging solutions for RF, Microwave and Telecommunications including single layer and multilayer capacitors, assemblies, voltage dividers, resistors, power terminations, resistive products, attenuators, multilayer chip and wire wound inductors.
Not Applicable
$
8.95
Solutions for the RF, Microwave and Telecommunications Industries - Am
ATC provides component and custom integrated packaging solutions for RF, Microwave and Telecommunications including single layer and multilayer capacitors, assemblies, voltage dividers, resistors, power terminations, resistive products, attenuators, multilayer chip and wire wound inductors.
Not Applicable
$
8.95
WAFER FAB COMPONENTS,BARE DICE PRODUCTS,CHIP DIODESS MANUFACTURER,BARE
Bare die products,bare dice components, bare dies is a manufacturer of semiconductor chip and wire components and thin film products for chip and wire hybrid circuits assembly. manufactures known good dies, bare die,flip chip and wafer-level chip-scale packaging for system-in-package (SiP),multi-chip modules packaging.
Not Applicable
$
8.95
WAFER FAB COMPONENTS,BARE DICE TECHNOLOGIES,CHIP DIODESS MANUFACTURER,
Bare die TECHNOLOGIES,bare dice components, bare dies is a manufacturer of semiconductor chip and wire components and thin film TECHNOLOGIES for chip and wire hybrid circuits assembly. manufactures known good dies, bare die,flip chip and wafer-level chip-scale packaging for system-in-package (SiP),multi-chip modules pa
Not Applicable
$
8.95
WAFER FAB COMPONENTS,BARE DICE TECHNOLOGIES,CHIP DIODESS MANUFACTURER,
Bare die TECHNOLOGIES,bare dice components, bare dies is a manufacturer of semiconductor chip and wire components and thin film TECHNOLOGIES for chip and wire hybrid circuits assembly. manufactures known good dies, bare die,flip chip and wafer-level chip-scale packaging for system-in-package (SiP),multi-chip modules pa
Not Applicable
$
8.95
WAFER FAB COMPONENTS,BARE DICE TECHNOLOGIES,CHIP DIODESS MANUFACTURER,
Bare die TECHNOLOGIES,bare dice components, bare dies is a manufacturer of semiconductor chip and wire components and thin film TECHNOLOGIES for chip and wire hybrid circuits assembly. manufactures known good dies, bare die,flip chip and wafer-level chip-scale packaging for system-in-package (SiP),multi-chip modules pa
Not Applicable
$
8.95
Diode-transistor-MOSFET-resistor-capacitor manufacturer supplier-Shenz
Hottech was founded in 1992.It is a national high-tech enterprise dedicated to the research and development, packaging, testing, manufacturing and sales of semiconductor analog chips and discrete devices.
Not Applicable
$
8.94
